RISC Platform

RP-113

Carrier Board for NXP SMARC™ Module

  • For SMARC™ V2.2 modules
  • Supports 19V~24V DC-in, reset, power, RTC function
  • Supports 10 Gigabit LAN, Gigabit LAN, audio, USB 3.0, COM (RS232/422/485)
  • With MicroSD socket, Mini PCIe with USB, SIM socket on board
  • With M.2 E-Key 2230 for Wi-Fi/BT, M.2 B-Key 3042/3052 for 4G/5G
  • Supports 2x CAN transceiver, TTL interface, LVDS, HDMI, MIPI-CSI camera
  • NEW
  • Fanless
  • Wide Temperature
  • RISC Based
Form Factor Carrier Board
Compliant with SMARC™ 2.2
Edge I/O 1x RJ45 10GbE
2x RJ45 GbE
2x USB 3.0 Type A
1x USB 2.0 Type C for firmware download
1x HDMI
1x COM (RS232/422/485)
1x SD Slot
2x Nano SIM slot
1x DC-in jack (19V~24V)
1x Headphone & MIC
Internal I/O 2x CAN bus 2.0B
2x CAN bus via SPI
2x USB3.0 (pin header)
1x Fan (4-wire)
1x 3.3V/5V/12V back light wafer
1x MIPI display power (3.3V/5V)
1x MIPI-DSI/LVDS 4-lanes
1x LVDS 4-lanes
1x MIPI-CSI2 2-lanes
1x MIPI-CSI2 4-lanes
12x GPIOs (1.8V)
2x RS232 (RX/TX, pin header)
1xI²C (capacitive touch pin header)
1x I²S
1x QSPI (pin header)
1x mPCIe slot (PCIe, USB2.0, PCM)
1x M.2 E-Key 2230 slot (PCIe, SDIO, UART, USB 2.0)
1x M.2 B-Key 3042/3052 slot (USB 3.0 only)
1x Speaker R and L
1x RTC battery
4x LEDs
Jumpers, Switches & Buttons 1x Boot select switch
1x Power button
1x Reset button
1x Sleep button
1x LID button
Power Input 19V~24V DC-in
Dimensions 170mm x 140mm (6.7” x 5.5”)
Environment Humidity: 0% to 90% RH at 60° C (non-condensing)
Operating Temperature -40°C ~ 85°C (-40°F ~ 185°F)
OS Support Based on the CPU module
Certification CE/FCC Class B
RP-113 RISC Carrier Board for NXP SMARC™2.2 modules, 19V~24V DC-in, 170mmx140mm, 2x CAN, Mini PCIe with USB, 2x USB header, 1x I²C header, DSI/LVDS, Speaker out, Line in/ Line out, MIPI CSI, 12x GPIO, 2x RS232, 1x RS232/422/485, VDDIO=1.8V
DATASHEETS RP-113
CATALOGS RISC-Based Embedded Solutions (Vol.26.04)
USER'S MANUALS RP-113 V1.0 (IBASE Server) RP-113 V1.0 (Google Drive)

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