Embedded Computing


COM Express Type 10 (R3.0) Carrier Board

  • 1x PCI-E (x1), 2x Mini PCI-E sockets (full-size & half-size)
  • 8x USB 2.0, 2x USB 3.0
  • Supports 1x eDP or 1x LVDS(based on COMe module), 1x DisplayPort
  • 2x LAN connectors
  • Wide Temperature
Form Factor Mini ITX
Module Interface COM Express Type-10 (R3.0)
Expansions slots 1x PCI-E(x1) slot
Mini Type Slots 1x MiniPCI-E socket (full-size)
1x MiniPCI-E socket (half-size)
Video Output 1x DisplayPort
1x LVDS or 1 x eDP (By option)
Ethernet LAN1: Derived from COM Express CPU module
LAN2: 1x Intel I210IT
I/O Chip Fintek F81846D-I
Serial Port 2x COM ports (RS232)
USB 2.0 8x USB 2.0
USB 3.0/ 3.1 2x USB 3.0
Serial ATA 2x SATA III
Audio Built-in ALC662 or ALC888S HD audio codec
Digital I/O 4-in/4-out
Watchdog 256 levels
Parallel N/A
Dimensions (L X W) 170mm x 170mm (9.6" x 9.6")
Power DC-in 12V only
Operating Temperature -40°C~85°C (-40°F~185°F)
Storage Temperature -40°C~90°C (-40°F~194°F)
Relative Humidity 10%~90% (non-condensing)
IP417 COM Express Type-10 Carrier Board, supports eDP or LVDS
CATALOGS Embedded Computing (Vol.23)

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