Embedded Computing


Intel® Atom® x7/x5 COM Express Type 10 (R3.0) CPU Module

  • Onboard Intel® Atom® x7-E3950/ x5-E3940/ x5-E3930 Processor [i-Temp support]
  • Onboard DDR3L memory with ECC support
  • 1x Intel® I210IT Gigabit LAN
  • Supports TPM (2.0), eMMC5.0 (optional)
  • Wide-range operating temperature from -40°C to 85°C
  • Wide Temperature

The ET876 COM Express Type 10 CPU Module (R3.0) supports Intel's energy-efficient Atom® Processor E3900 series, Intel® Celeron® Processor N3350 and Intel® Pentium® Processor N4200. It utilizes multi-core processor technology for high-performance computing and flexible programmable graphics, making it ideal for today's mission-critical IoT, transportation, medical, military, and industrial automation applications.

ET876 COM Express

The highly integrated ET876 comes in a compact form factor (84 x 55mm) and matches the performance requirements of cost-effective, small footprint embedded systems. It benefits from the Intel Gen9 graphics engine featuring DirectX 12, OpenGL 4.3 and OpenCL 2.0 to deliver stunning graphics and 4K resolution output, as well as simultaneous display combinations of DDI and LVDS or eDP. Connectivity options on the carrier board can include 8x USB 3.0, 2x USB 3.0, and 2x SATA III. All models support Gigabit connectivity, 4GB DDR3L with ECC standard, TPM hardware security and up to 32GB of eMMC storage.

The ET876 operates with an extended temperature range of -40°C to 85°C for remote outdoor deployments depending on the processor used and runs both Linux and Windows 10 operating systems.

CPU Intel Atom® x7-E3950 Processor (1.6GHz~2.0GHz)
Intel Atom® x5-E3940 Processor (1.6 GHz~1.8GHz)
Intel Atom® x5-E3930 Processor (1.3 GHz~1.8GHz)
PCH Integrated in Intel® SoC
Memory Onboard 4GB memory, DDR3L 1600MHz with ECC
Watchdog Timer 256 levels
H/W Monitor Yes
Storage Device Interface eMMC 5.0 up to 32GB (optional)
Expansion Slots 4x PCI-E(x1)
Graphics Controller Intel® SoC integrated Gen9-LP graphics
Video Output 1x DDI
1x LVDS or 1x eDP (optional)
Ethernet Intel® I210IT PCI-E Gigabit LAN
I/O Chipset F81804U-I
Serial Port 2x UART (Tx/Rx only))
USB 2.0 8x USB 2.0 via Carrier Board
USB 3.X 2x USB 3.0 via Carrier Board
Serial ATA 2x SATA III
Audio Intel® Atom® SoC built-in HD audio controller
TPM TPM (2.0)
Others I2C
Dimensions (L X W) 84mm x 55mm (3.3" x 2.17")
Power Consumption Intel® Atom® E3950 1.6GHz w/ 4GB LDDR3L 1600
+12V: 1.42A
Operating Temperature -40°C ~ 85°C (-40°F~185°F)
Storage Temperature -40°C ~ 90°C (-40°F ~ 194°F)
Relative Humidity 90% (non-condensing @60°C)
ET876-X7LV COM Express (Type-10) CPU Module with Intel® Atom® x7-E3950 (2.0GHz) on board, LVDS, 4GB DDR3L memory on board
ET876-X5QLV COM Express (Type-10) CPU Module with Intel® Atom® x5-E3940 (1.8GHz) on board, LVDS, 4GB DDR3L memory on board
ET876-X5LV COM Express (Type-10) CPU Module with Intel® Atom® x5-E3930 (1.8GHz) on board, LVDS, 4GB DDR3L memory on board
IP417 Mini-ITX COM Express Type-10 (R3.0) Carrier Board
HSET876-1 Heat spreader for ET876-420/ 335
HSET876-X-1 Heat spreader for ET876-X7/ X5Q/ X5
HSET876-A Heatsink w/ FAN for ET876-420/ 335
HSET876-X-A Heatsink w/ FAN for ET876-X7/ X5Q/ X5
HSET876-X-B Heatsink w/o FAN for ET876-X5 (only temp -40°C ~80°C)
CATALOGS Embedded Computing (Vol.23)


Model Chipset Video Audio Network Others

Intel Chipset

Windows 10

Intel Apollolake Graphics

Windows 10

Realtek High Definition Audio

Windows 10

Intel I21x

Windows 10

Intel TXE

Windows 10

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