Embedded Computing
ET876
Intel® Atom® x7/x5 COM Express Type 10 (R3.0) CPU Module
- Onboard Intel® Atom® x7-E3950/ x5-E3940/ x5-E3930 Processor [i-Temp support]
- Onboard DDR3L memory with ECC support
- 1x Intel® I210IT Gigabit LAN
- Supports TPM (2.0), eMMC5.0 (optional)
- Wide-range operating temperature from -40°C to 85°C
The ET876 COM Express Type 10 CPU Module (R3.0) supports Intel's energy-efficient Atom® Processor E3900 series, Intel® Celeron® Processor N3350 and Intel® Pentium® Processor N4200. It utilizes multi-core processor technology for high-performance computing and flexible programmable graphics, making it ideal for today's mission-critical IoT, transportation, medical, military, and industrial automation applications.
The highly integrated ET876 comes in a compact form factor (84 x 55mm) and matches the performance requirements of cost-effective, small footprint embedded systems. It benefits from the Intel Gen9 graphics engine featuring DirectX 12, OpenGL 4.3 and OpenCL 2.0 to deliver stunning graphics and 4K resolution output, as well as simultaneous display combinations of DDI and LVDS or eDP. Connectivity options on the carrier board can include 8x USB 3.0, 2x USB 3.0, and 2x SATA III. All models support Gigabit connectivity, 4GB DDR3L with ECC standard, TPM hardware security and up to 32GB of eMMC storage.
The ET876 operates with an extended temperature range of -40°C to 85°C for remote outdoor deployments depending on the processor used and runs both Linux and Windows 10 operating systems.
CPU | Intel Atom® x7-E3950 Processor (1.6GHz~2.0GHz) Intel Atom® x5-E3940 Processor (1.6 GHz~1.8GHz) Intel Atom® x5-E3930 Processor (1.3 GHz~1.8GHz) |
PCH | Integrated in Intel® SoC |
Memory | Onboard 4GB memory, DDR3L 1600MHz with ECC |
BIOS | AMI |
Watchdog Timer | 256 levels |
H/W Monitor | Yes |
Storage Device Interface | eMMC 5.0 up to 32GB (optional) |
Expansion Slots | 4x PCI-E(x1) |
Graphics Controller | Intel® SoC integrated Gen9-LP graphics |
Video Output | 1x DDI 1x LVDS or 1x eDP (optional) |
Ethernet | Intel® I210IT PCI-E Gigabit LAN |
I/O Chipset | F81804U-I |
Serial Port | 2x UART (Tx/Rx only)) |
USB 2.0 | 8x USB 2.0 via Carrier Board |
USB 3.X | 2x USB 3.0 via Carrier Board |
Serial ATA | 2x SATA III |
Audio | Intel® Atom® SoC built-in HD audio controller |
TPM | TPM (2.0) |
Others | I2C |
Dimensions (L X W) | 84mm x 55mm (3.3" x 2.17") |
Power Consumption | Intel® Atom® E3950 1.6GHz w/ 4GB LDDR3L 1600 +12V: 1.42A |
Operating Temperature | -40°C ~ 85°C (-40°F~185°F) |
Storage Temperature | -40°C ~ 90°C (-40°F ~ 194°F) |
Relative Humidity | 90% (non-condensing @60°C) |
ET876-X7LV | COM Express (Type-10) CPU Module with Intel® Atom® x7-E3950 (2.0GHz) on board, LVDS, 4GB DDR3L memory on board |
ET876-X5QLV | COM Express (Type-10) CPU Module with Intel® Atom® x5-E3940 (1.8GHz) on board, LVDS, 4GB DDR3L memory on board |
ET876-X5LV | COM Express (Type-10) CPU Module with Intel® Atom® x5-E3930 (1.8GHz) on board, LVDS, 4GB DDR3L memory on board |
IP417 | Mini-ITX COM Express Type-10 (R3.0) Carrier Board |
HSET876-1 | Heat spreader for ET876-420/ 335 |
HSET876-X-1 | Heat spreader for ET876-X7/ X5Q/ X5 |
HSET876-A | Heatsink w/ FAN for ET876-420/ 335 |
HSET876-X-A | Heatsink w/ FAN for ET876-X7/ X5Q/ X5 |
HSET876-X-B | Heatsink w/o FAN for ET876-X5 (only temp -40°C ~80°C) |
DATASHEETS | ET876 |
CATALOGS | Embedded Computing (Vol.23) |
USER'S MANUALS | ET876 V1.0 |
DRIVERS - BOARDS | ET876 Driver DVD |
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